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Power Semiconductors Assembly

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Power Semiconductors Assembly
Power Semiconductors Assembly
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Power Semiconductors Assembly

Single-phase full-control bridge B2C series, single-phase half-control bridge B2Hx series, single-phase rectification bridge B2U series

Cooling method Device
type		 Type
-Id-VVN		 Rated output
current
ld(A)		 Outline Cooling
condition		 Device
voltage
(V)
Air cooling Modules B2x-xxx-xxxFA 40~160 Fig.1a Wind speed
≥6m/s
Ambient temperature
≤40℃		 100~2000
B2x-xxx-xxxFB 180~200 Fig.1b
B2x-xxx-xxxFC 250~400 Fig.3
Capsule
devices		 B2x-xxx-xxxFD 300~800 Fig.9b
B2x-xxx-xxxFE 800~1200 Fig.10b
B2x-xxx-xxxFF 1200~2000 Fig.13b
Water cooling Capsule
devices		 B2x-xxx-xxxSA(B/C/D/E) 100~2500 Fig.15-19 Flow≥4L/min
Intake Water temperature≤40℃

 

 

Three-phase rectification bridge B6U series, three-phase full-control bridge B6C series, three-phase half-control bridge B6HK series.
Cooling method Device
type		 Type
-Id-VVN		 Rated output
current
Id(A)		 Outline Cooling
condition		 Device voltage
(V)
Air cooling Modules B6x-xxx-xxxFA 80~200 Fig.1a Wind speed
≥6m/s
Ambient temperature
≤40℃		 100~2000
B6x-xxx-xxxFB 200~300 Fig.1b
B6x-xxx-xxxFC 300~500 Fig.3
Capsule B6x-xxx-xxxFD 400~1600 Fig.9a
B6x-xxx-xxXFE 1000~2000 Fig.10a
B6x-xxx-xxxFF 1500~3000 Fig.13a
Water cooling Capsule B6x-xxx-xxxSA(B/C/D/E) 300~4000 Fig.15-19 Flow≥4L/min
Intake Water temperature≤ 40℃

 

 

Six phase bridge

Cooling method Device
type		 Type
-Id-VVN		 Rated output current ld(A) Outline Cooling
condition		 Devicevoltage
(V)
double-star type
with
balance reactor		 double-star type
without
balance reactor
Air cooling Modules M6x-xxx-xxxFA 150~350 130~300 *Fig.1a Wind speed
≥6m/s
Ambient temperature
≤40℃		 100~2000
M6x-xxx-xxxFB 450~600 350~500 *Fig.1b
M6x-xxx-xxxFC 800~1200 600~800 *Fig.3
Capsule
devices		 M6x-xxx-XxxFD 1500~2500 1200~2000 Fig.9a
M6x-xxx-xxxFE 3000~4000 2500~3400 Fig.10a
M6x-xxx-xxxFF 5000~6000 4000~5000 Fig.13a
M6x-xxx-xxxFG 1500~1800 1000~1500 Fig.14
Water cooling Capsule
devices		 *M6x-xxx-xxxSA
(B/C/D/E)		 500~8000 400~5000 *Fig.15-19 Flow≥4L/min
Intake Water
temperature≤40℃

 

 

Single phase AC switch

Cooling method Devicetype Type
-IRMS-VNN		 Rated output
current
IRMS(A)		 Outline Cooling
condition		 Device voltage
(V)
Air cooling Modules W1C-xxx-xxxFA 90~150 Fig.2a Wind speed
≥6m/s Ambient temperature
≤40℃		 100~2000
W1C-xxx-xxxFB 200~250 Fig.2b
W1C-xxx-xxxFC 300 Fig.4
Capsule devices W1C-xxx-xxxFD 400~800 Fig.5
W1C-xxx-xxxFE 1000~1200 Fig.6
W1C-xxx-xxxFF 1500~1800 Fig.11
Water cooling Capsule
devices		 W1C-xxx-xxxSA(B/C/D/E) 600~2500 Fig.15-19 Flow≥4L/min
Intake Water temperature≤40℃
W1C-xxx-xxxSI(J/K) 800~1200 Fig.20~22

Thee phase AC switch

Cooling method Device
type		 Type
-IRMS-VVN		 Rated output
current
IRMS(A)		 Outline Cooling
condition		 Device
voltage
(V)
Air cooling Modules W3C-xxx-xxxFA 90~150 Fig.2a Wind speed
≥6m/s Ambient temperature
≤40℃		 100~2000
W3C-xxx-xxxFB 200~250 Fig.2b
W3C-xxx-xxxFC 300 Fig.4
Capsule devices W3C-xxx-xxxFD 400~800 Fig.7
W3C-xxx-xxxFE 1000~1200 Fig.8
W3C-xxx-xxxFF 1500~1800 Fig.12

 

 

Six phase AC switches

Cooling method Device
type		 Type
-Id-VNN		 Rated output
current
Id(A)		 Outline Cooling
condition		 Device
voltage
(V)
Air
cooling		 Modules (B6C)2x-xxx-xxxFA 80~150 *Fig.26a Wind speed
≥6m/s
Ambient temperature
≤40℃		 100~2000
(B6C)2x-xxx-xxxFB 200~260 *Fig.26b
Capsule
devices		 (B6C)2x-xxx-xxxFE 800~1200 Fig.24
(B6C)2x-xxx-xxxFF 1500~2000 Fig.25
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